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Écrit par David Borel
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16-05-2007 |
| Publication Number: |
US 20070109737
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| Inventors:
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Kriege; Michael; (San Jose, CA)
Hong; Dan; (Sunnyvale, CA)
DiFonzo; John; (Emerald Hill, CA)
Zadesky; Stephen; (Redwood City, CA)
Lynch; David; (Boulder Creek, CA)
Lundgren; David; (Mill Valley, CA)
Merz; Nick; (San Carlos, CA) |
| Assignee Name:
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Apple Computer, Inc. |
| Filling Date: |
December 29, 2006 |
| Publication Date: |
May 17, 2007 |
Abstract:
A computing device having an improved enclosure arrangement is disclosed. One aspect of the enclosure pertains to enclosure parts that are structurally bonded together to form a singular composite structure. In one embodiment, structural glue is used to bond at least two unique parts together. Another aspect of the enclosure pertains to enclosure parts that are electrically bonded together to form a singular integrated conductive member. In one embodiment, conductive paste is used to bond at least two unique parts together. The improved enclosure is particularly useful in portable computing devices such as laptop computers.
Original Document: Available
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Dernière mise à jour : ( 17-05-2007 )
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